As we all know, the difficulty of semiconductor material technology lies in the breakthrough of process manufacturing technology. The semiconductor material cutting fluid plays an important role in the stable performance, cleaning performance, cooling performance, lubrication performance, anti-rust performance, and oil removal performance of the semiconductor processing process. The quality of semiconductor material cutting fluid is related to product processing efficiency and finished product qualification rate, and even has many effects on the life of processing machinery and equipment.
Usually, a third-party testing agency wants to issue a report, it must test the samples according to the standards. The testing standard for semiconductor material cutting fluid is the national recommended standard: GB/T 31469-2015 "Semiconductor material cutting fluid". GB/T 31469-2015 divides the cutting fluid of semiconductor materials into three grades: Type I, Type II, and Type III. As for the classification, it is mainly distinguished by the two indexes of viscosity and density. Viscosity testing index requirements are respectively type Ⅰ≤40mPa.s, type Ⅱ should be between 40-52mPa.s, type Ⅲ require ≥52mPa.s. Density testing index requirements are type Ⅰ between 1.103-1.118g/cm³ , Type Ⅱ should be between 1.113-1.126g/cm³, Type Ⅲ should be between 1.118-1.130g/cm³.
In addition to the viscosity and density testing indicators, GB/T 31469-2015 also stipulates that the appearance testing of semiconductor material cutting fluids should be colorless or slightly yellow transparent liquids. Chromaticity requirements ≤50Hazen. The pH value should be between 5.0-7.0. The moisture content is required to be less than or equal to 0.5%, and the conductivity is required to be less than or equal to 10us/cm. When we detect these indicators, we should pay attention that the detection reagents must use superior grade pure reagents, and electronic grade ultrapure water is also needed when using water. The resistivity of ultrapure water should be no less than 18.2 ohm.cm.
The above is the relevant knowledge of semiconductor material cutting fluid detection. In the process of cutting semiconductor materials, cutting fluid plays a very important role. The use effect of cutting fluid is directly related to its grade and performance. Testing can help us better understand the actual quality of the cutting fluid, thereby providing necessary data support for our decision-making, whether it is process improvement, new product research and development, market sales, government spot checks, procurement and trade, it has a positive role in promoting.
